中文产品说明: | 合金组成: Sn/Ag3.0/Cu0.5。 ULF-208-98是本公司获千住授权SAC305合金专利的无铅锡膏,是使用含氧率低的无铅锡粉,本产品不含铅,为符合Rohs的环保产品,并有絶佳的印刷解析性及连续印刷性,而且不需清洗,为一款免洗型之无铅锡膏。 |
英文产品说明: | Alloys: Sn/Ag3.0/Cu0.5 ULF series is a new Pb-free solder paste using very low oxide-level
spherical Pb-free solder powder mixed with specially developed high technical
Pb-free flux without washing. As the paste contains no Pb, it will largely
contribute to the protection of global environment. Furthermore, excellent
resolution and reliability can also be obtained during continuous printing.
It is under IEC Halogen free standard, RoHS standard and American PrEn14582
standard. |